USACH BOULEPRO 200AX

Currently the only machine of its kind, the BOULEPRO 200AX enables much faster and more cost-effective conversion of boules into pucks to meet the high demand for silicon carbide (SiC), an important semiconductor material. With its SSDC (Single-Step Dual-Plane Compensation) capability, the BOULEPRO 200AX turns a traditionally multi-step process performed on multiple machines into a single-machine process that dramatically improves efficiency and costs at each step.

• Improved part speed
• Reduced labour input
• Less space required in production
• Excellent process repeatability
• Reduction in required consumables
• Up to 500 times more accurate angular orientation

• Silicon carbide is a semiconducting or semi-insulating material used in many different types of electronic devices such as diodes, MOSFETS, JFETS, etc. It replaces silicon-based devices for applications that require high power density, high frequencies and high voltages.
  Electric vehicles (EVs) and 5G are major users of this type of component.
• Silicon carbide is traditionally grown by physical vapour transport (PVT) in high-temperature furnaces, and it takes 2 to 4 weeks to grow a crystal (boule) of just a few kilograms in size.
  The crystal must then be machined into a wafer-ready puck and then cut into wafers on which component manufacturers can build.
• Kellenberger has developed an innovative solution for this post-growth processing step, in which a wafer-ready puck is created from the grown boule