Currently the only machine of its kind, the Boule Pro enables much faster and more cost-effective conversion of boules into pucks to meet the high demand for silicon carbide (SiC), an important semiconductor material. With its SSDC (Single-Step Dual-Plane Compensation) capability, the Boule Pro turns a traditionally multi-step process performed on multiple machines into a single-machine process that dramatically improves efficiency and costs at each step.
USACH BOULE PRO
Improved parts speed
Good Price-Performance ratio
Reduced production footprint
THE FUTURE OF SEMICONDUCTOR MANUFACTURING HAS BEGUN
SOLUTION ADVANTAGES
- Improved part speed
- Reduced labour input
- Less space required in production
- Excellent process repeatability
- Reduction in required consumables
SIC MARKET AND END APPLICATIONS
- Silicon carbide is a semiconducting or semi-insulating material used in many different types of electronic devices such as diodes, MOSFETS, JFETS, etc. It replaces silicon-based devices for applications requiring high power density, high frequencies and high voltages.
It replaces silicon-based devices for applications that require high power density, high frequencies and high voltages.
Electric vehicles (EVs) and 5G are major users of this type of component. - Silicon carbide is grown by physical vapour transport (PVT) in high-temperature furnaces, and it takes 2 to 4 weeks to grow a crystal (boule) of just a few kilograms in size.
The crystal must then be moulded into a wafer-ready puck and then cut into wafers on which component manufacturers can build. - Hardinge has developed an innovative solution for this post-growth processing step, in which a wafer-ready puck is created from the grown boule
TECHNICAL DATA BOULEPRO 200 AX
Key data
Dimensions
220” x 169” x 130” (5600 x 4300 x 3300 mm)
Weight, approximate (in basic configuration)
25,000 lbs. (11,363 kg)
Required power, approximate
72A
Machine Axis
X-axis travel
19.68” (500 mm)
Z-axis travel
23.62” (600 mm)
9.8” (250 mm)
X2-axis travel
0 – 787” / minute (0 – 20 m / minute)
Axis resolution (all linear axes)
.000004” (.1 micron)
Axis resolution B and B1
0.00002 deg
Weg
*The data may vary depending on the application.
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